Nozzle cleaner for dispensing equipment
|Application area:||Dispenser cleaning|
|Appearance/smell:||colorless to slightly yellow, clear|
|Density at 20 °C:||1.111 +/- 0.005 g/cm³|
|Boiling point/boiling range:||>100 °C|
|Flash point:||95 °C|
|Operations temperature:||room temperature to max. 70°C|
|Reliable cleaning results with:||solder pastes, SMT Adhesives|
|Storage conditions:||ideal in original packaging at 10°C–25°C|
The solvent-based, pH-neutral medium is suitable especially for cleaning nozzles and dispenser needles from solder paste as well as SMT adhesive residues.
It is used in suitable cleaning systems (e.g. ultrasonic) at room temperature, increasing the cleaning performance temperature (40-55°C) accelerates the process and improves the cleaning. The cleaned component is then rinsed with DI water.
Consider approvals of equipment manufacturer!
Check compatibility with cleaning machine prior to use!
Efficient removal of solder paste residues and SMT-adhesives within nozzles and dispensing needles; low odor; high flashpoint; excellent water-rinsability; helps to eliminate flammable solvents from within the production area.
Questions about our products?
We will advise you by phone 06123 / 7046-0.