Soldering Equipment Maintenance
|Application area:||Soldering machine cleaning|
|Appearance/smell:||Colorless to slightly yellow, clear|
|Density at 20 °C:||0.997 +/- 0.005 g/cm³|
|Boiling point/boiling range:||>100 °C|
|Operations temperature:||Room temperature|
|Reliable cleaning results with:||Flux residues, Condensate from PCB boards|
|Storage conditions:||Ideal in original packaging at 10°C–25°C|
The water-based, alkaline cleaning medium efficiently removes flux residues and outgassing from circuit boards from reflow-, wave-, selective- and vapour-phase soldering systems. Due to the foaming formula an improved effect is achieved, even when used with still hot soldering machines, the mild inherent odor convinces.
The cleaning medium is sprayed onto the surfaces to be cleaned at room temperature and wiped off after several minutes. Due to the innovative formula when reaching soldering temperatures of >200 degrees, no cleaning agent residues of any kind remain in the soldering machine system.
Consider approvals of equipment manufacturer!
Multi-purpose, aqueous cleaning media for maintenance of soldering equipment; foaming formulation ensures better cleaning performance; low odor even when used with warm equipment; replacement for flammable and corrosive chemicals in maintenance cleaning operations.
Questions about our products?
We will advise you by phone 06123 / 7046-0.