Stencil underside-wiping during printing process
|Application area:||Underside cleaning in stencil printer|
|Appearance/smell:||Colorless to slightly yellow, clear|
|Density at 20 °C:||0.965 +/- 0.005 g/cm³|
|Boiling point/boiling range:||>100 °C|
|Flash point:||61 °C|
|Operations temperature:||Room temperature|
|Reliable cleaning results with:||Leaded, lead-free, no-clean solder pastes, SMT-adhesives|
|Storage conditions:||Ideal in original packaging at 10°C–25°C|
The water-based, pH-neutral cleaning medium efficiently removes residues of solder pastes containing lead, lead-free or so-called No-Clean solder pastes as well as of SMT adhesives from the underside of the stencil. After the printing process, Etimol SUC 61 RAN optimally wets both the cleaning roller or the cleaning fleece as well as the underside of the stencil, so that constant high and qualitatively reproducible cleaning results are achieved.
The innovative homogeneous formula and the optimized evaporation properties grant reliable process stability, printing repeatability and defined solderpaste printing sharpness. Depending on the printer model and manufacturer the cleaning medium is either filled undiluted directly into the reserve tank of the stencil printer at room temperature or aspirated directly from the delivery drum.
Consider approvals of equipment manufacturer!
Efficient removal of solder paste and SMT-adhesive residues from stencil underside grants repeatable and stable cleaning steps which help to achive highquality printing results. The waterbased formulation combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area.
Questions about our products?
We will advise you by phone 06123 / 7046-0.