SMT-Stencil cleaning within automatic equipment
|Application area:||(Automatic) SMT stencil cleaning|
|Appearance/smell:||Colorless to slightly yellow, clear|
|Application:||1 part concentrate : 4 parts DI water|
|Density at 20 °C:||0.922 +/- 0.005 g/cm³|
|Boiling point/boiling range:||>100 °C|
|Operations temperature:||Room temperature|
|Reliable cleaning results with:||Leaded, lead-free, no-clean solder pastes, SMT-adhesives|
|Storage conditions:||Ideal in original packaging at 10°C–25°C|
The water-based, pH-neutral cleaning concentrate is diluted in the ratio 1:4 with DI water (corresponds to ready to use Etimol SW 25 RAN) and then efficiently removes residues of solder paste containing lead, lead-free or so-called No-Clean solder pastes as well as of SMT adhesives from SMD stencils in automatic washing machines. The pH-neutral formula features excellent compatibility with the common stencil materials. Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaners, so that the intervals between the bath changes can be extended significantly and the resulting volumes of waste for disposal are reduced.
The cleaner can be excellently rinsed with water and itself. The cleaning medium is filled in the cleaning tank of the stencil washing system at room temperature.
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!
Concentrate to dilute with DI-water. Efficient removal of solder paste and SMT-adhesive from stencils grants repeatable and stable cleaning process which helps to achive high-quality printing results. The waterbased formulation combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area.
Questions about our products?
We will advise you by phone 06123 / 7046-0.