SMT-Stencil cleaning within automatic equipment
|Application area:||(Automatic) SMT stencil cleaning|
|Appearance/smell:||colorless to slightly yellow, clear|
|Application:||1 part concentrate : 4 parts DI water|
|Density at 20 °C:||0.923 +/- 0.005 g/cm³|
|Boiling point/boiling range:||>100 °C|
|Operations temperature:||Room temperature|
|Reliable cleaning results with:||leaded, lead-free, no-clean solder pastes, SMT-adhesives|
|Storage conditions:||ideal in original packaging at 10°C–25°C|
The water-based, slightly alkaline adjusted cleaning concentrate is diluted with DI water in the ratio 1:4 (then corresponds to ready to use Etimol SW 26 RAA) and then efficiently removes residues of solder paste containing lead, lead-free or so-called No-Clean solder pastes as well as of SMT adhesives from SMD stencils in automatic washing machines. The formula features excellent compatibility with the stencil materials commonly used and, especially with μ-GBA and Fine-Pitch stencils, has an efficient cleaning effect.
Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaners, so that the intervals between the bath changes can be extended significantly and the resulting volumes of waste for disposal are reduced.
The cleaning agent can be excellently rinsed with water. The cleaning medium is filled in the cleaning tank of the stencil washing system at room temperature.
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!
Concentrate to dilute with DI-water. Efficient removal of solder paste and SMT-adhesive from epecially μBGA and Fine-pich stencils grants repeatable and stable cleaning process which helps to achive high-quality printing results. The waterbased formulation combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area.
Questions about our products?
We will advise you by phone 06123 / 7046-0.