(Automatic) SMT stencil cleaning
|Application area:||(Automatic) SMT stencil cleaning|
|Appearance/smell:||colorless to slightly yellow, clear|
|Density at 20 °C:||0,96 – 0,99 g/cm³|
|Boiling point/boiling range:||93-95°C °C|
|Flash point:||82 °C|
|Operations temperature:||room temperature|
|Reliable cleaning results with:||leades, lead-free, no-clean solder pastes SMT-adhesives|
|Storage conditions:||ideal in original packaging at 10-25°C|
The water-based and drying-optimized, pH-neutral cleaning medium efficiently removes residues of lead-containing, lead-free or so-called no-clean solder pastes as well as SMT adhesives from SMT stencils in automatic washing systems.
Etimol SW 25/FD RAN was specially developed for washing systems that have no or insufficient drying/heating.
The pH-neutral formulation exhibits excellent compatibility with common stencil materials. The innovative formulation achieves high bath loading rates compared to standard cleaners, allowing intervals between bath changes to be significantly extended and, in some cases, significantly reducing the amount of waste generated for disposal. The cleaner is excellent rinsable with water and itself.
The cleaning medium is filled into the cleaning tank of the stencil washer at room temperature.
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!
Reliably removes solder paste and SMT adhesives from SMT stencils. The innovative formulation combines efficient cleaning, maximum process reliability and optimum occupational safety by replacing flammable and combustible solvents. Optimum rinsability.and optimum drying properties.
Questions about our products?
We will advise you by phone 06123 / 7046-0.