Special Flux for wave-, selective-, hand-soldering
Typ ISO 9454: 1231 (1.2.3.A)
DIN-EN 61190-1-1 (J-STD-004): (IEC RE/L0) / (NO CLEAN)
|Application area:||Wave- and selective soldering|
|Appearance/smell:||Colorless- reddish, clear liquid|
|Solids content:||2,9% (2,8 – 3,1 %) Gew.-% (wt.-%)|
|Density at 20 °C:||0,799 (+/- 0,005) g/ml|
|Acid number:||25 - 29 mg KOH/g mg KOH/g|
|Activators:||(Di-) carboxylic acid complex with synthetic resin (Resin)|
|Solvents:||Short chain alcohols|
|Flash point:||ca. 12 °C|
GSP-2933/RX/OVAP is a flux of the latest generation. It is a high performance NOCLEAN flux based on alcohol with di-carboxylic acid activator complex and synthetic resin. This flux was used for selective u. Wellenlötprozesse, as well as for dip soldering process and cable-strands-tining developed. The application can be carried out by any usual application method (except foams).
Recommendations for the processing of this flux:
This flux is very versatile, both in wave soldering and special applications are good results. The generally valid rule to choose applied flux quantities as low as possible, also applies to this product.
Spray fluxing: When dosing, the amount of flux initially to 15 – 30 ml / min. Adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.
Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 ° C, recommended for “more complex” boards from 100 – 130 ° C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.
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