Alcohol-based flux, high resin content, di-carboxylic
acids, halogen-free (WEEE/RoHS compliant)
ISO-9454: 1131 // DIN EN 61190-1-1: L0 (ROL0)
|Application area:||Manual- and repair soldering, dip soldering|
|Appearance/smell:||yellowish to amber, clear|
|Solids content:||15.0 Gew.-%|
|Density at 20 °C:||0.830 (+/-0.005) g/ml|
|Acid number:||45–55 mg KOH/g|
|Activators:||di-carboxylic acids, resins|
|Flash point °C:||12|
The SSK-15 soldering flux has a high proportion of solids and contains organic, halogen-free activation additives. The soldering flux can be applied using all conventional application methods, whereby spray fluxing is not advisable due to the high solids content. The main areas of application are in manual, repair and dip soldering. Due to the high resin content, the soldering flux residues are encapsulated.
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