Otto's Original - Quality products since 1901

Flux

Alcohol-based flux

Alcohol-based fluxes have a very wide range of applications. The fluxes have very good soldering properties, in particular with the step-through and the wetting of the circuit board. The process window is very wide, with high thermal stability and good process activity over a long time interval. The residue behavior is also very good, the circuit boards are very clean after the soldering process.

Product Solids content Application area Activators
EO-B-001A (Multiflux) 2.2 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, low resin content
EO-B-001B (Multiflux) 3.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, low resin content
EO-B-001C (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, low resin content
EO-B-002A (Multiflux) 2.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, very low resin content
EO-B-002B (Multiflux) 3.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, very low resin content
EO-B-002B/X (Multiflux) 3 % Gew.-% Wave-, selective- and manual soldering processes, as well as cable assembly carboxylic and dicarboxylic acids – activator complex, rosin
EO-B-002C (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, very low resin content
EO-B-004 (Multiflux) 1.8 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, very low resin content
EO-B-006A (Multiflux) 2.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering non-halogen, di-carboxylic acids, no resin content
EO-B-006B (Multiflux) 3.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering non-halogen, di-carboxylic acids, no resin content
EO-B-006C (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering non-halogen, di-carboxylic acids, no resin content
EO-B-007A (Multiflux) 1.9 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, very low resin content
EO-B-007B (Multiflux) 3.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, very low resin content
EO-B-007C (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, very low resin content
EO-B-008 (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, low resin content
EO-B-009A (Multiflux) 2.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, no resin content
EO-B-009B (Multiflux) 3.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering non-halogen, di-carboxylic acids, no resin content
EO-B-009C (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering non-halogen, di-carboxylic acids, no resin content
EO-B-010A (Multiflux) 2.0 % Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering Di-carboxylic acids, synthetic resin complex
EO-B-010B (Multiflux) 2,6% Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, synthetic resin complex
EO-B-010C (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, synthetic resin complex
EO-B-013 (Multiflux) 4.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering halogen-free (di-)carboxylic acid complex
EO-B-016 5 % (4,9 – 5,3 %) Gew.-% Wave and selective soldering processes, as well as for manual soldering processes, dip soldering processes and strand tinning. (Di-)Carboxylic acid activator resin complex (ISO-9454: 1231)
EO-RF-G002 3,9 – 4,1 % Gew.-% Selective soldering, manualsoldering Carboxylic- and dicarboxylic-acid-complex / Activator system from FLUX EO-G-002 (#6015)
EO-RF-G003 3,9 – 4,1 % Gew.-% Selective soldering, manualsoldering Carboxylic- and dicarboxylic-acid-complex
EO-RF-WB30 3,9 - 4,1% Gew.-% Selective soldering, manualsoldering Carboxylic- and dicarboxylic-acid-complex / Activator system from Flux WB-30… systems
EO-RF-WB35 3,9 – 4,1 % Gew.-% Selective soldering, manualsoldering Carboxylic- and dicarboxylic-acid-complex / Activator system from Flux WB-35… systems
GSP-2533/RX 2.5 Gew.-% Wave soldering (spray- and foam fluxing) synthetic resin with di-carboxylic acids
GSP-2533/RX/OVAP 2.5 Gew.-% Wave soldering (spray fluxing) synthetic resin with di-carboxylic acids
GSP-2633/RX (Multiflux) 2,6% (2,5 – 2,7 %) Gew.-% Wave soldering (spray- and foam fluxing) and selective soldering (Di-) carboxylic acid complex with synthetic resin (Resin)
GSP-2633/RX/OVAP (Multiflux) 2,6% (2,5 – 2,7 %) Gew.-% Wave- and selective soldering (Di-) carboxylic acid complex with synthetic resin (Resin)
GSP-2933/RX (Multiflux) 2,9% (2,8 – 3,1 %) Gew.-% Wave- and selective soldering (Di-) carboxylic acid complex with synthetic resin (Resin)
GSP-2933/RX/OVAP (Multiflux) 2,9% (2,8 – 3,1 %) Gew.-% Wave- and selective soldering (Di-) carboxylic acid complex with synthetic resin (Resin)
HR/D-110 5.8 Gew.-% Selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, resins
PM-334 (Multiflux) 3.0 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, minimal resin content
RS-4004 (Multiflux) 3.5 Gew.-% Wave- and selective soldering, manual- and repair soldering, dip soldering di-carboxylic acids, minimal resin content
S-250/FR 2.5 Gew.-% Wave soldering (spray- and foam fluxing) synthetic resin with di-carboxylic acids
S-250/FRO 2.5 Gew.-% Wave soldering (spray fluxing) di-carboxylic acids with synthetic resin
Solder Tincture WFF approx. 38 Gew.-% Manual-, repair- and dip soldering, soldering on ceramic substrates, strand tinning Balsamic resin, di-corboxylic acids, halogenated amine
SSK-15 (No-Clean) 15.0 Gew.-% Manual- and repair soldering, dip soldering di-carboxylic acids, resins