Flux
Flux concentrates
The flux concentrates from Emil Otto are of particular interest to customers who require large quantities of flux or manufacture abroad. All granulates can be transported without hazardous substance identification and with a significantly reduction in size.
A flux becomes a hazardous substance if it contains alcohol, among other things. The flux concentrates are free of this as the customer mixes the alcohol or the alcohol-water mixture on site. The mixing of the flux is very simple, because each concentrate contains the necessary information, which liquid has to be added to the concentrate and in which dosage.
The granulate quantities are sufficient for 10 or 20 liters.
Furthermore, the granulates can be packaged more easily and with less volume, which also reduces transportation costs. Due to this transport optimizations the flux concentrates can be transported economically over long distances, as freight carriers charge very low costs for non-hazardous goods.
The concentrates include fluxes for wave and selective soldering as well as manual and dip soldering.
| Product | Solids content | Application area | Activators |
|---|---|---|---|
| EO-B-001A (Multiflux) | 2.2 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-001B (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-001C (Multiflux) | 4.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-002A (Multiflux) | 2.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-002B (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-002B/X (Multiflux) | 3 % Gew.-% (wt.-%) | Wave-, selective- and manual soldering processes, as well as cable assembly | carboxylic and dicarboxylic acids – activator complex, rosin |
| EO-B-002C (Multiflux) | 4.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-006A (Multiflux) | 2.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-006B (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-006C (Multiflux) | 4.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-007A (Multiflux) | 1.9 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-007B (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-007C (Multiflux) | 4.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-009A (Multiflux) | 2.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, no resin content |
| EO-B-009B (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-009C (Multiflux) | 4.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content |
| EO-B-011B | 3,0 % Gew.-% (wt.-%) | Wave-, selective- and hand-soldering | dicarboxylic acids, synthetic resin complex |
| EO-G-001 | 3.5 Gew.-% (wt.-%) | Wave- and selective soldering | di-carboxylic acids |
| EO-G-002 | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering | di-carboxylic acids, synthetic resin |
| EO-G-006 | 5.0 Gew.-% (wt.-%) | Wave soldering (spray fluxing), hand and selective soldering | di-carboxylic acid complex |
| EO-MC-001 | Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | organic hydrohalogen complex |
| EO-Y-004 | 3.5–3.7 Gew.-% (wt.-%) | Wave- and selective soldering | di-carboxylic acids |
| GSP-25/AF/OVAP | 2,5 Gew.-% (wt.-%) | Wave- and selective soldering | di-dicarboxylic acids |
