Otto's Original - Quality products since 1901
Flux
Flux Dispenser Bottles
| Product | Solids content | Application area | Activators |
|---|---|---|---|
| EO-B-001A (Multiflux) | 2.2 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-001B (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-002B (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-007C (Multiflux) | 4.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-Flux-Dosing bottle EO-RF-G002, Plus EO-Compact-Flux-Pen | 3,9 – 4,1 % Gew.-% (wt.-%) | Selective soldering, manualsoldering | Carboxylic- and dicarboxylic-acid-complex / Activator system from FLUX EO-G-002 (#6015) |
| EO-Flux-Dosing bottle EO-RF-WB30, Plus EO-Compact-Flux-Pen | 3,9 - 4,1% Gew.-% (wt.-%) | Selective soldering, manualsoldering | Carboxylic- and dicarboxylic-acid-complex / Activator system from Flux WB-30… systems |
| EO-Flux-Dosing bottle EO-RF-WB35, Plus EO-Compact-Flux-Pen | 3,9 – 4,1 % Gew.-% (wt.-%) | Selective soldering, manualsoldering | Carboxylic- and dicarboxylic-acid-complex / Activator system from Flux WB-35… systems |
| EO-RF-G003 | 3,9 – 4,1 % Gew.-% (wt.-%) | Selective soldering, manual soldering | Carboxylic- and dicarboxylic-acid-complex |
| HR/D-110 | 5.8 Gew.-% (wt.-%) | Selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, resins |
| PM-334 (Multiflux) | 3.0 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content |
| RS-4004 (Multiflux) | 3.5 Gew.-% (wt.-%) | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content |
| Solder Tincture WFF | approx. 38 Gew.-% (wt.-%) | Manual-, repair- and dip soldering, soldering on ceramic substrates, strand tinning | balsamic resin, di-corboxylic acids, halogenated amine |
| SSK-15 (No-Clean) | 15.0 Gew.-% (wt.-%) | Manual- and repair soldering, dip soldering | di-carboxylic acids, resins |
