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Electronics

Solder pastes / solders for electronics production

Solder pastes for reworking play an essential role in the reworking of electronic assemblies, as they ensure the quality and reliability of the rework process. Emil Otto offers a range of rework solder pastes with a variety of added values.

Rework pastes are lead-free solder pastes that are characterized by high activity and good wetting and spreading properties.

The rework pastes are mixed with halogen-free fluxes and are therefore ideal for manual and repair soldering of all kinds. All pastes are available in syringes with a quantity of 10 or 20 g. For hand and repair soldering, the rework paste can be applied directly with the syringe, which enables precise dosing and positioning of the paste. Subsequent soldering can be carried out using hot air and soldering irons.

In individual cases, which must be checked by the user, these pastes can also support the wave soldering of critical components.

Catalog number

Product

Solids content

Application

Activators

Cat. no. 4611

EO-FLP-001

-

Repair work on printed circuit boards, tinning of components

Halide-free and lead-free activators

Cat. no. 4615

EO-FLP-005

-

Repair work on printed circuit boards, tinning of components

Halide-free, lead-free, low melting point

Cat. no. 4600

EO-RP-001

-

Repair work on printed circuit boards, tinning of components

Halogen-free, lead-free

Cat. no. 4604

EO-RP-005

-

Repair work on printed circuit boards, tinning of components

Halogen-free, lead-free, low melting point

-

Solder wire Sn96.5 Ag3 Cu0.5

-

Selective soldering processes, hand soldering

Resin activation complex

-

Solder wire SnCu0.7Ni0.05Ge
(AOX 755 corresponds to Sn100C)

-

Selective soldering processes, hand soldering

Resin activation complex

Cat. no. 0084

ZINNIN GREEN I Sn100

-

Conventional soft soldering of steel, stainless steel, copper and brass materials

-

Cat. no. 0094

ZINNIN GREEN II Sn96.5Ag3.0Cu0.5

-

Conventional soft soldering of steel, stainless steel, copper and brass materials

-

Cat. no. 0095

ZINNIN GREEN III SnCu3

-

Conventional soft soldering of steel, stainless steel, copper and brass materials

-

Reliable adhesion

Solder pastes from Emil Otto have a strong adhesion before the soldering process. The components form a firm bond with the circuit board during the soldering process, which is an important aspect, especially when repairing or replacing faulty components. After all, insufficient adhesion can lead to contact problems and impair the functionality of the assembly.

Economic efficiency

Cost-efficient solutions are crucial for companies. With solder pastes that are characterized by high performance and low application costs at the same time, the overall costs of post-processing can be reduced.

Optimum melting temperature

The ability of the solder paste to melt at specific temperatures is crucial. A suitable melting temperature ensures that the solder paste melts evenly and therefore ensures a solid connection without damaging sensitive components. The melting point of the solder paste is particularly important for reworking, as it is often necessary to protect existing components from damage.

Resistance to environmental influences

Reworking must create durable connections that can withstand thermal and mechanical stresses. High-quality solder pastes from Emil Otto ensure stability even under demanding conditions.

Easy handling

Solder pastes from Emil Otto are easy to apply, which speeds up the reworking process. The user-friendly consistency and viscosity of the SMD solder pastes make them easier to use, especially for fine SMD components.

Flexibility in the soldering process

As solder pastes from Emil Otto are suitable for various soldering processes, they can be used flexibly in different production environments. Lead-free, lead-containing or no-clean solder pastes are suitable for a wide range of applications. The portfolio also includes solder pastes that have been specially developed for brass or soft soldering. Each paste is available in different grain sizes and guarantees optimum solder joints for a wide range of materials and processes. This means that excellent results can be achieved with the solder pastes and production processes can be optimized.