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Electronics

Solder pastes - Indispensable for reworking and repairing PCBs

High-quality reflow solder pastes

Catalog number

Product

Solids content

Application

Activators

Cat. no. 4611

EO-FLP-001

-

Repair work on circuit boards, tinning of components on PCBA

Halide-free and lead-free activators

Cat. no. 4615

EO-FLP-005

-

Repair work on circuit boards, tinning of components on PCBA

Halide-free, lead-free, low melting point

Cat. no. 4600

EO-RP-001

-

Repair work on circuit boards, tinning of components on PCBA

Halogen-free, lead-free

Cat. no. 4604

EO-RP-005

-

Repair work on circuit boards, tinning of components on PCBA

Halogen-free, lead-free, low melting point

-

Solder wire Sn96,5Ag3Cu0,5

-

Selective soldering processes, hand soldering

resin activation complex

-

Solder wire SnCu0.7Ni0.05Ge
(AOX 755 acc. Sn100C)

-

Selective soldering processes, hand soldering

resin activation complex

Cat. no. 0084

ZINNIN GREEN I Sn100

-

Conventional soft soldering and tinning of steel, stainless steel, brass and copper alloys

-

Cat. no. 0094

ZINNIN GREEN II Sn96.5 Ag3.0 Cu0.5

-

Conventional soft soldering and tinning of steel, stainless steel, brass and copper alloys

-

Cat. no. 0095

ZINNIN GREEN III SnCu3

-

Conventional soft soldering and tinning of steel, stainless steel, brass and copper alloys

-

The most important advantages of solder pastes from Emil Otto

Reliable adhesion

Solder pastes from Emil Otto have a strong adhesion before the soldering process. The components form a firm bond with the circuit board during the soldering process, which is an important aspect, especially when repairing or replacing faulty components. After all, insufficient adhesion can lead to contact problems and impair the functionality of the assembly.

Economic efficiency

Cost-efficient solutions are crucial for companies. With solder pastes that are characterized by high performance and low application costs at the same time, the overall costs of post-processing can be reduced.

Optimum melting temperature

The ability of the solder paste to melt at specific temperatures is crucial. A suitable melting temperature ensures that the solder paste melts evenly and therefore ensures a solid connection without damaging sensitive components. The melting point of the solder paste is particularly important for reworking, as it is often necessary to protect existing components from damage.

Resistance to environmental influences

Reworking must create durable connections that can withstand thermal and mechanical stresses. High-quality solder pastes from Emil Otto ensure stability even under demanding conditions.

Easy handling

Solder pastes from Emil Otto are easy to apply, which speeds up the reworking process. The user-friendly consistency and viscosity of the SMD solder pastes make them easier to use, especially for fine SMD components.

Flexibility in the soldering process

As solder pastes from Emil Otto are suitable for various soldering processes, they can be used flexibly in different production environments. Lead-free, leaded or No Clean solder pastes are suitable for a wide range of applications. The portfolio also includes solder pastes that have been specially developed for brass or soft soldering. Each paste is available in different grain sizes and guarantees optimum solder joints for a wide range of materials and processes. This means that excellent results can be achieved with the solder pastes and production processes can be optimized.