Description
This rework paste (lead-free) with metal alloy content [Sn 96.5 Ag 3.0 Cu 0.5] (>85 %) was developed for repair work on printed circuit boards and components and is characterized, among other things, by high activity as well as good wetting and spreading. Due to these properties, the paste should be applied sparingly. The paste is applied from a dosing syringe using a metal dosing needle. This enables precise dosing and positioning of the paste.
These rework pastes (lead-free) containing a metal alloy [Sn 96.5, Ag 3.0, Cu 0.5] (>85 %) have been developed for repair work on circuit boards and components and are characterized, among other things, by a high level of activity as well as good wetting and spread. Due to these properties, the paste should be applied sparingly. The paste is applied with a dispensing syringe via a metal dispensing needle. This enables precise dispensing and positioning of the paste. The rework paste can be applied using hot air or a soldering iron. In certain cases—which must be verified by the user—this paste can also be used for wave soldering of critical components. The paste is applied as described.
Customer added value
Highly effective
Perfect soldering results
Very wide process window
Versatile application possibilities
Economical in use
Contaminated pads and pins are also activated
No crystal formation, paste remains homogeneous and stable
Careful and targeted dosing
Low odor, hardly development of vapors