Expanded No Clean flux portfolio at productronica 2025

At productronica 2025 in Munich, Emil Otto will be presenting further flux innovations from the alcohol-water-based No Clean flux segment for electronics manufacturing.

Visitors to the trade fair will be introduced to the additional variants A, C and OVAP of the multi-flux fluxes EO-F-001 and 002 as well as the entire portfolio in hall A4, booth 315. In addition to fluxes, this also includes cleaning media, solders, soldering aids and ESD products.

The fluxes EO-F-001 and 002 were specially developed for wave, selective, dip and manual soldering processes as well as for cable assembly and differ in the composition of the activator systems and the VOC content. Both products belong to the multiflux fluxing agents, which can be used for both spray and foam fluxing. They impress with their versatility and offer a high degree of process reliability. A particular advantage is their no-clean property. PCBs usually do not need to be washed after processing, which eliminates additional process steps and thus saves costs.

"The advantage of the EO-F variants is that, despite the reduced alcohol content, they can be used almost identically to pure alcohol-based fluxes. Our EO-F-001 and EO-F-002 variants are in high demand, especially in the Southern and Eastern European markets."

Thanks to their non-corrosive formulation and halide-free activators, the other flux variants EO-F-001A and EO-F-001C ensure reliable and durable solder joints. Users benefit from flexible applicability in both leaded and lead-free soldering processes as well as the option of using different application methods, including foam fluxing. With a solids content of 2 % for EO-F-001A and 4 % for EO-F-001C, two further variants are available. The respective OVAP variants are suitable for all application areas, but not for foam fluxing.

Cat. no. 6470
Recommended method of application
Spray fluxing, selective, manual and dip soldering

No Clean-Flux, alcohol- and water-based
Di-carboxylic acid resin complex, halide-free (WEEE/RoHS compliant)
Type ISO 9454: 2231 // DIN-EN 61190-1-1 (according to J-STD-004):L0 (IPC ORL0)

Cat. no. 6464
Recommended method of application
Foam and spray fluxing, selective, manual and dip soldering

No Clean-Flux, alcohol- and water-based
Di-carboxylic acid-resin complex, halide-free (WEEE/RoHS compliant)
Type ISO 9454: 2231 / DIN-EN 61190-1-1 (according to J-STD-004) (IPC ORL0)

"We therefore have alternatives for all manufacturing environments, especially for those in which flux application using foam is used or should be deliberately excluded. We thus offer clear process differentiation and customers can choose between a universal version including foam fluxes and a specialized OVAP version, which is also more attractively priced. In the case of pure application by spraying, the additive for foaming can be dispensed with. With the EO-F-001A and EO-F-001C, we not only offer the highest quality and safety, but also clear economic and sustainable advantages thanks to reduced cleaning steps, lower resource consumption and high process stability."

All EO-F-001 variants have a VOC content of 93 %.

Cat. no. 6465
Recommended method of application
Foam and spray fluxing, selective, manual and dip soldering

No Clean-Flux, alcohol- and water-based
Di-carboxylic acid resin complex, halide-free (WEEE/RoHS compliant)
Type ISO 9454: 2231 / DIN-EN 61190-1-1 (according to J-STD-004):L0 (IPC ORL0)

Cat. no. 6471
Recommended method of application
Spray fluxing, selective, manual and dip soldering

No Clean-Flux, alcohol- and water-based
Di-carboxylic acid resin complex, halide-free (WEEE/RoHS compliant)
Type ISO 9454: 2231 // DIN-EN 61190-1-1 (according to J-STD-004):L0 (IPC ORL0)

Emil Otto will also be presenting the flux variants EO-F-002A and EO-F-002C. These are also high-quality No Clean products that have been specially developed for wave, selective, dip and manual soldering processes as well as for cable assembly. Users benefit from an optimum combination of high process reliability, efficient processing and sustainable use of resources. The biggest advantage for production here is also the no-clean property. The EO-F-002 series is classified as non-corrosive and ensures reliable, long-lasting solder joints. With a solids content of 2 % for EO-F-002A or 4 % for EO-F-002C, customers can choose the right variant depending on their process requirements. Thanks to the halide-free activators and a modern solvent concept with a reduced VOC content of 75 %, the fluxes also support more environmentally friendly production. The OVAP versions EO-F-002A/OVAP and EO-F-002C/OVAP extend the portfolio with variants that are specially optimized for all application processes except foam fluxing.

Find out more about our alcohol-water-based fluxes for electronics production.