Description
This liquid solder paste (lead-free) with metal alloy content (>80 %) was developed for repair work on printed circuit boards and components. It has a low viscosity and is characterized, among other things, by high activity as well as good wetting and spreading. Due to these properties, the paste should be applied sparingly. It is usually applied with a brush, but can also be applied individually. EO-FLP-001 can be applied using a hot air or soldering iron.
Important note: The paste must be stirred before use!
The paste is applied with a dosing syringe via a metal dosing needle. This enables a precise dosing resp. positioning of the paste. The processing of the rework paste can be carried out using a hot-air or soldering iron. In individual cases, which must be checked by the user, the wave soldering of critical components can also be supported with this paste. The paste is applied as previously described.
Customer added value
- Highly effective
- Perfect soldering results
- Very wide process window
- Versatile application possibilities
- Economical to use
- Contaminated pads and pins are also activated
- No crystal formation, paste remains homogeneous and stable
- Careful and targeted dosing
- Low odour, hardly any development of vapors