Description
The flux paste EO-FP-002 was specially developed for repair work on assemblies and is characterized, among other things, by high activity and very good wetting and spreading properties. Due to these properties, the paste can be dispensed extremely sparingly. It is applied using plastic tips. These enable precise dosing and positioning of the paste and offer the advantage over steel needles that the printed circuit boards cannot be scratched. The flux paste can be applied using hot air and soldering irons, but also with a mini wave.
Customer added value
- Flawless soldering results
- Economical consumption
- Contaminated pads and component legs are also activated
- Careful and targeted dosage
- Wide process window (very high thermal stability, very high activity over a large interval)
- Highly viscous paste with which SMD components can be soldered extremely well due to its temperature stability