Water-based flux EO-G-012C

Recommended method of application

Wave, manual and selective soldering

No Clean-Flux, water-based
Di-carboxylic acid complex, halogen-free, resin-free (WEEE/RoHS-compliant)
Type ISO-9454: 2131 / DIN EN 61190-1-1 (according to J-STD004): L0 (IPC: ORL0)

Cat.-No. 6492
6492_EO-G-012C_Kanister_EN

Technical data

Appearance:colourless, transparent liquid
Hazardous goods:no
VOC:Low VOC“ (<5 %, solvent additives, water-based)
Solids content:3.9 - 4.2 wt.-%
Density at 20 °C:0.99 - 1.01 g/ml
Acid number:33 - 37 mg KOH/g
Resiny:no
Activators/resin:di-carboxylic acid complex, halogen-free, resin-free
Solvent:water with additives
Storage conditions:cool and dry in the sealed original container at 5 – 25 °C
Durability:12 months

Description

EO-G-012C is a no-clean flux, universally suitable for wave and selective soldering of printed circuit boards and contains organic, halogen-free and resin-free, activating additives specially adapted to the soldering processes. This flux has been developed in a combination with lead and lead-free solders specially adapted to the thermal requirements of the soldering process.

The EO-G-012C contains special additives so that this flux is also ideally suited for „low-melting processes“. It is based on a novel formulation to stabilize and improve the application process and residue behavior compared to conventional water or partially water-based fluxes. This water-based electronics flux leaves no sticky residue and is non-corrosive.
The solids content is 4%.

Customer added value

  • Non-flammable (no legal restrictions for transportation, storage and handling)
  • Very good soldering properties (capillarity, wetting)
  • Broad process window (high thermal stability, good activity over a long interval)
  • Especially suitable for low preheating temperatures and low-temperature processes
  • Very good residue behavior (optically clean, high SIR)

Recommendations for the processing of this flux:

This flux must be applied by spraying. After application, it is advisable to dry the flux in order to transform the liquid into fusible phase which favours the soldering operation.

Foam fluxes: Not recommended

Spray fluxing: If dosing is possible, first set the flux quantity to 15 – 20 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.

Preheating: A preheating temperature of 80 - 110 °C is recommended for „simple“ PCBs and 110 - 120 °C for „more complex“ PCBs on the top side of the PCB. It can be used in both leaded and lead-free solder systems.

Packaging units

Canister: 5 l, 20 l
Extras: Other packaging units on request

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Product information: EO-G-012C