Description
This rework paste (lead-free) with metal alloy component [Sn 42.0 Ag 0.4 Bi 57.6] (>85 %) has been developed for repair work on circuit boards and components and is distinguished, among other things, by a high level of activity as well as good wetting and spread. Due to these properties the paste should be applied sparingly.
The paste is applied with a dosing syringe via a metal dosing needle. This enables a precise dosing resp. positioning of the paste. The processing of the rework paste can be carried out using a hot-air or soldering iron. In individual cases, which must be checked by the user, the wave soldering of critical components can also be supported with this paste. The paste is applied as previously described.
Customer added value
Highly effective for low melting processes
Perfect soldering results
Very wide process window
Versatile application possibilities
Economical in use
Contaminated pads and pins are also activated
No crystal formation, paste remains homogeneous and stable
Careful and targeted dosing
Low odor, hardly development of vapors