Description
The water-based, alkaline cleaning medium efficiently removes flux residues and outgassing from PCBs from reflow, wave, selective and vapor phase soldering systems. The foaming formulation achieves an improved product effect, even when used on soldering machines that are still warm, the mild inherent odor is convincing.
Instructions for use:
The ready-to-use cleaning medium is sprayed onto the surfaces to be cleaned at room temperature and wiped off after a few minutes. Thanks to the innovative formulation, no cleaning agent residues remain in the soldering system when soldering temperatures >200 °C are reached.
Customer added value
- Cleans reflow, wave, selective and vapor phase soldering systems reliably and efficiently
- Aqueous formulation, foaming
- Practical spray bottle with foam nozzle
- Low odor development even when the system is still warm
- No flammable and corrosive chemicals used in maintenance cleaning.