Description
The solvent-based, pH-neutral cleaning medium efficiently removes residues of leaded, lead-free or so-called no-clean solder pastes as well as SMT adhesives from the underside of the stencil. After the printing process, Etimol SUC 63 RSN optimally wets both the cleaning roller or cleaning fleece and the stencil side, so that consistently high and qualitatively reproducible cleaning results are achieved. The mild odor formulation combines good cleaning properties with optimum drying properties. This significantly minimizes the smearing of solder paste particles on the underside of the stencil.
Instructions for use:
Depending on the printer model and manufacturer, the cleaning medium is either poured undiluted directly into the supply tank of the stencil printer at room temperature or drawn directly from the delivery container.
Note:
Consider approvals of equipment manufacturer!
Customer added value
- Reliably removes solder paste and SMT adhesive residues from the underside of the stencil to ensure optimum printing results. The innovative formulation combines efficient cleaning, maximum process reliability and optimum occupational safety by replacing flammable and combustible solvents. Can also be used in suitable washing systems.