Etimol SW 21 CA

Description

The water-based, slightly alkaline adjusted cleaning concentrate is diluted with DI water in the ratio 1:4 (corresponds to ready to use Etimol SW 26 RAA) and then efficiently removes residues of solder paste containing leaded, lead-free or so-called No Clean solder pastes as well as of SMT adhesives from SMD stencils in automatic washing machines. The formula features excellent compatibility with the stencil materials commonly used and, especially with μ-BGA and Fine-Pitch stencils, has an efficient cleaning effect. Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaners, so that the intervals between the bath changes can be extended significantly and the resulting volumes of waste for disposal are reduced.

Customer added value

• Concentrate to dilute with DI-water
• Efficient removal of solder paste and SMT-adhesive especially with μ-BGA and Fine-pitch stencils grants repeatable and stable cleaning process which helps to achive high-quality printing results
• The innovative formulation combines efficient cleaning, maximum process safety and optimum occupational safety by replacing flammable and combustible solvents