Cleaning product Etimol SW 21 CA

Description

The water-based, slightly alkaline adjusted cleaning concentrate is diluted with DI water in the ratio 1:4 (corresponds to ready to use Etimol SW 26 RAA) and then efficiently removes residues of solder paste—including leaded, lead-free, and so-called "no-clean" solder pastes—as well as SMT adhesives from SMD stencils in automatic washing machines. The formula is highly compatible with commonly used stencil materials and provides an effective cleaning action, particularly for μ-BGA and fine-pitch stencils. Thanks to its innovative formula, it achieves high bath loading values compared to standard cleaners, allowing for significantly longer intervals between bath changes and reducing the resulting volume of waste for disposal.

Customer added value

• Concentrate to dilute with DI-water
• Efficient removal of solder paste and SMT-adhesive especially with μ-BGA and Fine-pitch stencils grants repeatable and stable cleaning process which helps to achive high-quality printing results
• The innovative formulation combines efficient cleaning, maximum process safety and optimum occupational safety by replacing flammable and combustible solvents