Description
GSP-2533/RX/OVAP established over the course of many years, is S-250/FRO’s predecessor. Very good soldering results were achieved regardless of the respective type of system. The level of cleanliness is very good. The thermal stability is also very high and achieves good activity over a wide interval. GSP-2533/RX/OVAP is unsuitable for foam fluxing. It’s not recommended for selective or manual soldering. Please note the shelf life of 6 month. Practice has shown, that no washing is needed for PCBA properly soldered with this flux. The IC test with needle adapters generally completes without problems.
Customer added value
- Very good soldering properties (capillarity, wetting)
- Broad process window (very high thermal stability, good activity over a long interval)
- Very good residue behaviour (very clean, high SIR)