SMD adhesives IQ-BOND 3401 (red)

Recommended method of application

Jetting, high-speed dispensing

The high-quality SMD adhesives from IQ-Bond are suitable for double-sided equipped printed circuit boards, SMT applications as well as mixed large and small components

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Technical data

Curing:1-2 min at 150 °C
5 min at 120 °C
Viscosity (mPa.s):80.000
Degree of hardness:85 D
Processing time:5 days

Description

Der Einsatz von Klebstoffen in der Elektronik­fertigung ist seit Jahren ein fester Bestandteil. Besonders in den Bereichen Verkleben und Fixieren von elektronischen Komponenten werden Klebstoffe häufig eingesetzt. Die Eigenschaften wie Temperaturstabilität, elektrische Leitfähigkeit, Entgasung, mechanische Stabilität, Haltbarkeit und Verarbeitbarkeit haben sich in der Vergangenheit kontinuierlich verbessert.

Customer added value

  • Quick curing in comparison to conventional SMD adhesives which leads to quicker throughput processes
  • High-speed printing and dispensing as well as dosing applications
  • Comparable with lead-free soldering processes
  • Compliance with REACH/ROHS requirements
  • High initial strength and stable point profiles
  • Best process repeatability in the industry

Packaging units

Cartridge: 350 g
Injection syringes: 10 cmÂł, 30 cmÂł
Extras: And/or vessels

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Product information: IQ-BOND 3401 (red)