Water-based flux with alcohol additive (LOW VOC),
activated halogen-free, with synthetic resin. (rosin-free)
ISO-9454: Typ 2231 (2.2.3.A) DIN EN 61190-1-1 (J-STD-004):
|Application area:||Wave- and selective soldering|
|Solids content:||2.0 Gew.-%|
|Density at 20 °C:||0.9–1.0 g/ml|
|Acid number:||16–19 mg KOH/g|
|Activators:||dicarboxylic acids, synthetic resin|
|Solvents:||water with alcohol additive|
|Flash point:||not easily flammable °C|
|Additive:||wetting agent, alcohol combination <10%|
EO-Y-005A is universally suitable for the wave- and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives formulated with a small amount of synthetic resin. This flux was developed in a combination with lead- and lead-free solders, coordinated especially to the thermal requirements of the soldering process.
EO-Y-005A contains special alcoholic additives for the stabilization and improvement of the drying time in comparison with conventional water- or partially water-based fluxes.
Recommendations for the processing of this flux:
This flux is very versatile in use and OSP-compatible. Good results are achieved with manual-, wave- and selective soldering as well as for cable manufacture/strand tinning. The generally applicable rule, to select as little of the applied flux as possible, is also valid for this product.
Foam fluxes: Not recommended
Spray fluxes: With the possibility of dosing the amount of fluxing agent, first set to 30–40 ml/min., observe the even distribution of flux on the circuit board (if necessary test with heat-sensitive paper) and then adjust to the optimal amount.
Pre-heating: With “simple” circuit boards a pre-heating temperature of 80–110 °C is recommended on the top side of the circuit board, with “more complex” boards a temperature of 100–130 °C is recommended. The operation can be carried out both in solder systems containing lead as well as lead-free solder systems.
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