Solder paste EOSOL Solder Paste Al „Bi“

Recommended method of application

For soft soldering and tinning aluminum and aluminum alloys

Ready-to-use soft solder paste for aluminum
Low-melting, highly activated, and lead-free (solder: Sn42Bi57Ag1) (WEEE/RoHS-compliant)
Type ISO-9454: 2131

Cat.-No. 0965
EOSOL Al Bi aluminium soft solder paste Emil Otto_en_web

Technical data

Appearance: grey-silver paste
Metal alloy: Sn42Bi57Ag1 (low-melting)
Particle size: < 80 µ
Metal content: > 70 %
Flux type: 2.1.3.C
Flux content: < 30 %
Density at 20 °C: 3–4 g/mL

Customer added value

  • Special solder paste for soft soldering aluminum with Sn42Bi57Ag1
  • Simple handling, easy to stir
  • No separate solder feed required
  • Highly activated
  • Low melting point and wide temperature range: 150 to a maximum of 450 °C
  • Very clean solder joints
  • Extremely easy handling, no need for time-consuming soldering with tubular solder
  • Problem-free storage, can be stored at room temperature and does not harden (no polymerization reactions)
  • Not subject to labeling according to REACH (CLP) and GHS
  • Not classified as dangerous goods under current transport regulations

Packaging units

Brush bottle: 50 g
Extras: Other packaging units on request

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Product information: EOSOL Solder Paste Al „Bi“